Electronics system thermal management optimization using finite element and Nelder-Mead method

Nurul Kausar Ab Majid, Fatimah Sham Ismail

Abstract


The demand for high-performance, smaller-sized, and multi-functional electronics component poses a great challenge to the thermal management issues in a printed circuit board (PCB) design. Moreover, this thermal problem can affect the lifespan, performance, and the reliability of the electronic system.  This project presents the simulation of an optimal thermal distribution for various samples of electronics components arrangement on PCB. The objectives are to find the optimum components arrangement with minimal heat dissipation and cover small PCB area. Nelder-Mead Optimization (NMO) with Finite Element method has been used to solve these multi-objective problems. The results show that with the proper arrangement of electronics components, the area of PCB has been reduced by 26% while the temperature of components is able to reduce up to 40%. Therefore, this study significantly benefits for the case of thermal management and performance improvement onto the electronic product and system.

Keywords


finite element method; Nelder-Mead method; optimization; thermal distribution;

Full Text:

PDF


DOI: http://doi.org/10.12928/telkomnika.v17i5.12796

Refbacks

  • There are currently no refbacks.


Creative Commons License
This work is licensed under a Creative Commons Attribution-ShareAlike 4.0 International License.

TELKOMNIKA Telecommunication, Computing, Electronics and Control
ISSN: 1693-6930, e-ISSN: 2302-9293
Universitas Ahmad Dahlan, 4th Campus
Jl. Ringroad Selatan, Kragilan, Tamanan, Banguntapan, Bantul, Yogyakarta, Indonesia 55191
Phone: +62 (274) 563515, 511830, 379418, 371120
Fax: +62 274 564604

View TELKOMNIKA Stats