Ramdan, Dadan, Universitas Medan Area, Indonesia
-
Vol 9, No 1: April 2011 - Communication Engineering
Plastic Ball Grid Array Encapsulation Process Simulation on Rheology Effect
Abstract PDF -
Vol 14, No 1: March 2016 - Computer Science and Information System
Fluid Structure Interaction Numerical Simulation of Wiresweep in Electronics Packaging
Abstract
TELKOMNIKA Telecommunication, Computing, Electronics and Control
ISSN: 1693-6930, e-ISSN: 2302-9293
Universitas Ahmad Dahlan, 4th Campus
Jl. Ringroad Selatan, Kragilan, Tamanan, Banguntapan, Bantul, Yogyakarta, Indonesia 55191
Phone: +62 (274) 563515, 511830, 379418, 371120
Fax: +62 274 564604