Nguyen Thi, My Hanh, Industrial University of Ho Chi Minh City, Viet Nam

• Vol 19, No 2: April 2021 - Power Electronics and Drives
  TiO₂/silicone encapsulation film for achieving optical performance improvement of chip-on-board packaging LEDs
  Abstract  PDF

TELKOMNIKA Telecommunication, Computing, Electronics and Control
ISSN: 1693-6930, e-ISSN: 2302-9293
Universitas Ahmad Dahlan, 4th Campus
Jl. Ringroad Selatan, Kragilan, Tamanan, Banguntapan, Bantul, Yogyakarta, Indonesia 55191
Phone: +62 (274) 563515, 511830, 379418, 371120
Fax: +62 274 564604