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Ramdan, Dadan, Universitas Medan Area, Indonesia

Vol 9, No 1: April 2011 - Communication Engineering
Plastic Ball Grid Array Encapsulation Process Simulation on Rheology Effect
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Vol 14, No 1: March 2016 - Computer Science and Information System
Fluid Structure Interaction Numerical Simulation of Wiresweep in Electronics Packaging
Abstract

TELKOMNIKA Telecommunication, Computing, Electronics and Control
ISSN: 1693-6930, e-ISSN: 2302-9293

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